About the 10ACE project
The 10ACe project is about exploring and realizing technological solutions for the 10 Angstrom (1 nm) CMOS technology node, covering the entire value chain for manufacturing CMOS chips — from chip design to lithography to process technology and finally chip metrology. All is aimed at keeping pace with the semiconductor industry to follow "Moore's Law". The project addresses the following 4 main pillars that are relevant in enabling manufacture of 10Å technology: 1) lithography equipment, 2) chip design and mask optimization, 3) process technology, and 4) process characterization.
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In lithography equipment, ASML and expert EUV partners aim to increase key performance indicators of the EUV tool to enable smaller pitches and increase yield. They will also increase the sustainability of EUV machines, both during production and by increasing the number of times a module in an EUV tool can be refurbished.
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In chip design and mask optimization, imec, together with expert imaging, CAD and IP design partners, will assess the impact of the introduction of 3D monolithic CFET (mCFET) on chip design in terms of power, performance and area. They will also develop new computational lithography solutions to print 10Å CFET structures, improving imaging through next-generation mask designs.
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In process technology, imec and expert partners will demonstrate a fully functional monolithic CFET (mCFET) as the ultimate logic device, while also increasing the sustainability of the chip manufacturing process, including resist material development.
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In process characterization, Applied Materials and expert partners will explore and realize high-throughput and high sample density per wafer solutions for the analysis and characterization of 10Å 3D CFET devices, interconnect and materials.
At societal level, the expected impact of the 10ACe project will support the partners and their supplier network to stay at the leading edge of semiconductor developments, crucial to meet the digitization challenges of European society. Moreover, 10ACe will boost industrial competitiveness in the chip sector and help attract top talent in Europe, while enabling advances in areas such as computing, communications, security, mobility, health and further automation.
Project structure
The 10ACE project is structured into five closely connected work packages (WPs) that together address the key challenges for 10Å-node technology.
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WP1 provides overall project coordination and technical steering, manages innovation and IP, and ensures dissemination and exploitation of results across the full consortium of 31 participating organizations.
The technical work is covered by four work packages:
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WP2 develops EUV lithography equipment solutions aiming at the resolution and throughput performance required for the 10Å node, while improving sustainability through refurbishable module design.
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WP3 develops new computational lithography and CAD solutions for 10Å CFET structures, assessing the impact of 3D monolithic CFET (mCFET) on chip design in terms of power, performance and area, and improving imaging through next-generation mask designs.
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WP4 integrates process technology modules towards a fully functional monolithic CFET device demonstration, while also advancing sustainability enablers such as PFAS-free resist material development.
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WP5 develops high-throughput metrology and characterization methods for 10Å 3D CFET devices, interconnects and materials, enabling accurate quality control across the manufacturing chain.
The WPs are interrelated through iterative loops: lithography capabilities from WP2 are optimized through mask and design solutions in WP3, validated and integrated in WP4, and measured and controlled via WP5, with WP1 coordinating progress, alignment and impact throughout.
Project consortium
The 10ACe consortium brings together 31 organizations spanning the full semiconductor value chain — from chip design and lithography to process technology and metrology. Members include universities, research institutes, SMEs and large companies, drawn from 10 countries across Europe and beyond, including seven EU member states. ASML coordinates the consortium.